Description
A novel approach to flow sensors for the application in HVAC plants (heating ventilating air conditioning) will be developed. The proposed measurement method for fluid flows is based on a combination of calorimetric and anemometric conversion. Advanced printed circuit board (PCB) technology is envisioned for transducer construction. Heating resistors and separated thermistors are implemented as copper traces on the PCB carrier. The low temperature coefficient of resistivity offered by copper causes a low transduction efficiency of the flow transduction. This disadvantage must be compensated by a sophisticated electronic controller. FEM simulations of the thermal system have been performed. First transducer types will be available in near future. * This project is co-funded by the FFG withing the Bridg 1 programme.
Details
Duration | 01/03/2012 - 30/06/2015 |
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Funding | FFG |
Program | bridge |
Department | |
Principle investigator for the project (University for Continuing Education Krems) | Priv.-Doz.Dipl.-Ing.Dr. Thilo Sauter |
Project members |
Dr. Thomas Glatzl, MSc
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Publications
Glatzl, T. (2017). PCB Thermal Flow Sensor for Heating, Ventilating and Air Cooling Systems. Wien
Lectures
PCB Thermal Flow Sensor for Heating, Ventilating, and Air Cooling Systems (Lehrveranstaltung)
Rigorosum, 24/10/2017